ESD5B5.0ST1G
PACKAGE DIMENSIONS
SOD-523
CASE 502-01
ISSUE C
-X-
1
A
2
B
-Y-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
D 2 PL
DIM
MILLIMETERS
MIN NOM MAX
MIN
INCHES
NOM MAX
0.08 (0.003)
M
T X Y
A
B
1.10 1.20 1.30
0.70 0.80 0.90
0.043
0.028
0.047 0.051
0.032 0.035
C
D
J
K
0.50 0.60 0.70
0.25 0.30 0.35
0.07 0.14 0.20
0.15 0.20 0.25
0.020
0.010
0.0028
0.006
0.024 0.028
0.012 0.014
0.0055 0.0079
0.008 0.010
J
S
K
C
-T-
SEATING
PLANE
S
1.50 1.60 1.70
0.059
0.063 0.067
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
0.0157
SCALE 10:1
mm
inches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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ESD5B5.0ST1/D
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